The University of Texas at Austin

Texas Institute for Electronics

A University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions.

 

TIE Awarded $840M to Build a DOD Microelectronics Manufacturing Center, Advance U.S. Semiconductor Industry

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Researchers at the Texas Institute for Electronics
 

Our Vision and Mission

Vision: Innovate semiconductor solutions through advanced Heterogeneous Integration (HI)

Mission: Establish a non-profit, open-access semiconductor accelerator to:

  • Develop and execute a state-of-the-art 3DHI manufacturing technology roadmap
  • Provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth
  • Reinvent and expand pathways for an inclusive workforce and make Central Texas a premier hub for comprehensive workforce development
  • Scale-up TIE technologies through partnerships with domestic fabs and OSATs

The State of Texas has entrusted $552M for TIE to accomplish our Vision and Mission

 

Recipe to Change the World

Texas has the right ingredients to lead the next wave of semiconductor innovation:

an entrepreneurial culture, world-class fabs, a dynamic skilled workforce, and a thriving ecosystem of industry leaders and startups. TIE’s key initiatives focus on building sustainable state-of-the-art infrastructure to accelerate advanced microsystem integration and interconnect technology.

Technology Leadership

Accelerating 3D Heterogeneous Integration (3DHI) with cutting-edge interconnect solutions — hybrid bonding, multi-material integration, advanced thermal mitigation, and frontier 3DHI materials — all designed to speed time-to-market and deliver higher yields.

Critical Fab Assets 

Scaling an 84,000 sq. ft. cleanroom and R&D fab with state-of-the-art assembly and bonding tools. These facilities enable innovators to move seamlessly from prototyping to high-volume manufacturing, strengthening U.S. semiconductor leadership.

Workforce Development 

Expanding the semiconductor workforce at all levels — from technicians to PhDs — with programs that train the next generation of interconnect and microsystem innovators. TIE builds inclusive, future-ready talent pipelines to fuel long-term growth.

Defense/Startup Ecosystem 

Catalyzing breakthroughs at the edge of AI, quantum, healthcare, telecom, and defense. TIE’s pure-play foundry model empowers startups and established leaders alike to collaborate, innovate, and scale advanced microsystem solutions without compromise.

If you’re  working on advanced microsystem designs, and would like to learn how TIE’s advanced multi-material 3DHI capabilities can take your microsystem performance to the next level, please reach out to us here.

Industry Support for State of Texas Funding

“TIE’s vision, plans and achievements to-date have convinced us as corporate leaders in the semiconductor industry to join this effort and partner with TIE to provide technology leadership, build critical research and manufacturing infrastructure, and establish workforce development efforts that are essential to strategic long-term success for both the commercial and defense sectors of the US semiconductor industry.”

AMD logo

Mark Papermaster

AMD, Inc.

Chief Technology Officer and Executive Vice President

Applied Materials logo

Prabu Raja

Applied Materials, Inc.

President of Semiconductor Products Group

Intel logo

Babak Sabi

Intel Corporation

Senior Vice President and General Manager

Micron logo

Scott DeBoer

Micron Technology, Inc.

Executive Vice President

 

For more information about the Texas Institute for Electronics,
please email tie@austin.utexas.edu.