Founded in 2021 by S.V. Sreenivasan, Paras Ajay, Larry Dunn, and Shrawan Singhal in response to growing industry interest in 3DHI, TIE grew out of the of the NSF-funded NASCENT Center, which focused on scaling novel semiconductor process technologies for the factories of the future.

With support from the University of Texas at Austin and the Texas CHIPS Office, TIE secured $552 million in state funding by 2023—an investment that underscored Texas’s commitment to driving semiconductor innovation and U.S. manufacturing leadership.

TIE’s momentum accelerated in 2022 with the appointment of John Schreck, former Senior Vice President at Micron, as CEO. In 2024, TIE reached a new milestone when it was awarded $840 million from the Defense Advanced Research Projects Agency (DARPA) for the Next-Generation Microelectronics Manufacturing (NGMM) program, bringing total investments in 3DHI to ~$1.4 billion. This program, led by Principal Investigator S.V. Sreenivasan, is enabling the creation of a state-of-the-art 3DHI fabrication facility for research, development, and production of advanced microsystems.

Today, TIE is building a world-class 3DHI fabrication facility for research, development, and production. Under the leadership of CEO Dwayne LaBrake, with past leadership experience at 3M, Molecular Imprints, and as the President and CEO of Canon Nanotechnologies, TIE is bringing the next generation of microsystems to life.