Vision and Mission
Vision and Mission
The Texas Institute for Electronics (TIE) is leading the next wave of innovation in semiconductor manufacturing through advanced 3D heterogeneous integration (3DHI).
VISION
Innovate Semiconductor Solutions through advanced heterogeneous integration in AI, defense, automotive, telecom, and healthcare.
MISSION
We are driving the evolution of the semiconductor technology roadmap and building the nation’s first pure-play 3DHI microsystems foundry – a platform designed for speed, scale, and accessibility. From prototyping with diverse materials to scaling into volume production, we cut through complexity with:
ROADMAPS THAT MATTER
Executing a state-of-the-art 3DHI interconnect technology roadmap
PROTOTYPE-TO-SCALE FLOW
Providing seamless transitions from pilot manufacturing to high-yield, high-volume production
NEXT-GEN WORKFORCE
Training the talent pipeline for tomorrow’s semiconductor and interconnect leaders
ECOSYSTEM PARTNERSHIPS
Working with leading fabs, OSATs, and innovators to accelerate commercialization